高功率半导体激光器HPDDL用于激光热处理
<p></p><p></p><p><br/><span lang="EN-US" style="FONT-SIZE: 10.5pt; FONT-FAMILY: Arial; mso-bidi-font-size: 12.0pt; mso-fareast-font-family: 宋体; mso-font-kerning: 1.0pt; mso-ansi-language: EN-US; mso-fareast-language: ZH-CN; mso-bidi-language: AR-SA;">4140</span><span style="FONT-SIZE: 10.5pt; FONT-FAMILY: 宋体; mso-ascii-font-family: Arial; mso-hansi-font-family: Arial; mso-bidi-font-size: 12.0pt; mso-font-kerning: 1.0pt; mso-ansi-language: EN-US; mso-fareast-language: ZH-CN; mso-bidi-language: AR-SA; mso-bidi-font-family: Arial;">钢材料的表面硬化</span></p><span style="FONT-SIZE: 10.5pt; FONT-FAMILY: 宋体; mso-ascii-font-family: Arial; mso-hansi-font-family: Arial; mso-bidi-font-size: 12.0pt; mso-font-kerning: 1.0pt; mso-ansi-language: EN-US; mso-fareast-language: ZH-CN; mso-bidi-language: AR-SA; mso-bidi-font-family: Arial;"><p class="MsoNormal" style="MARGIN: 0cm 0cm 0pt;"><b style="mso-bidi-font-weight: normal;"><span style="FONT-SIZE: 18pt; FONT-FAMILY: 黑体; mso-hansi-font-family: Arial; mso-bidi-font-family: Arial;">高功率半导体激光器在热处理的应用<span lang="EN-US"><p></p></span></span></b></p><p class="MsoNormal" style="MARGIN: 0cm 0cm 0pt; TEXT-INDENT: 21pt; mso-char-indent-count: 2.0;"><span style="FONT-FAMILY: 宋体; mso-bidi-font-size: 10.5pt; mso-bidi-font-family: Arial;">相对于其他方式，火焰热处理和感应加热处理，利用激光对材料进行淬火处理，材料的变形会很小。可以说，激光热处理是目前热处理技术中最为先进的。同时，火焰淬火加工的材料的重复误差会比较大，同时也需要冷却的过程，还有对环境产生的污染。而感应淬火也需要比较长的冷却过程，由于热渗透的作用很大，局部变形也会较大。而激光淬火采用激光束直接在瞬间将材料表面加热到所需要的温度，没有任何的激光辐射会溢出光斑范围。由于激光对材料的加热仅仅限于工件表面，所以这种处理方式对工件体积重量的限制比较小。激光热处理加工的最大优势就在于加工的速度很快。而且由于热处理的表面会对工件产生一定的收缩压力，使得不仅仅是提高了工件的耐磨性，也提高工件的抗疲劳的能力。<span lang="EN-US"><p></p></span></span></p><p class="MsoNormal" style="MARGIN: 0cm 0cm 0pt; TEXT-INDENT: 21pt; mso-char-indent-count: 2.0;"><span style="FONT-FAMILY: 宋体; mso-bidi-font-size: 10.5pt; mso-bidi-font-family: Arial;">而高功率的半导体激光器则是激光热处理的最为理想的光源。和二氧化碳激光以及</span><span lang="EN-US" style="FONT-FAMILY: Arial;">Nd:YAG</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: Arial; mso-hansi-font-family: Arial; mso-bidi-font-family: Arial;">相比，半导体激光器很自然的就能够产生方形的均匀化的光斑，而其他激光器则需要如柱面透镜等复杂的光学器件对光束进行整形。而</span><span lang="EN-US" style="FONT-FAMILY: Arial;">800nm</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: Arial; mso-hansi-font-family: Arial; mso-bidi-font-family: Arial;">波长的激光正处于金属材料的高吸收范围，这样也减少了为了增加热处理工件对激光吸收率的问题而需要对工件进行预涂得工序。同时我公司的</span><span lang="EN-US" style="FONT-FAMILY: Arial;">ISL<chmetcnv wst="on" unitname="l" sourcevalue="4000" hasspace="False" negative="True" numbertype="1" tcsc="0">-4000L</chmetcnv></span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: Arial; mso-hansi-font-family: Arial; mso-bidi-font-family: Arial;">配置了</span><span lang="EN-US" style="FONT-FAMILY: Arial;">20kHz</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: Arial; mso-hansi-font-family: Arial; mso-bidi-font-family: Arial;">的可调制模块，使得能够在加工过程中更加精确的控制温度。</span><span lang="EN-US" style="FONT-FAMILY: Arial;"><p></p></span></p><p class="MsoNormal" style="MARGIN: 0cm 0cm 0pt; TEXT-INDENT: 21pt; mso-char-indent-count: 2.0;"><span lang="EN-US" style="FONT-FAMILY: Arial;">4140</span><span style="FONT-FAMILY: 宋体; mso-ascii-font-family: Arial; mso-hansi-font-family: Arial; mso-bidi-font-family: Arial;">钢材料的表面硬化。</span><span lang="EN-US" style="FONT-FAMILY: Arial;"><p></p></span></p><p class="MsoNormal" style="MARGIN: 0cm 0cm 0pt; TEXT-INDENT: 21pt; mso-char-indent-count: 2.0;"><span style="FONT-FAMILY: 宋体; mso-bidi-font-size: 10.5pt; mso-bidi-font-family: Arial;">高功率的半导体激光器的主要作用之一就是在需要<span lang="EN-US">100%</span>硬化处理的工件进行大面积的激光热处理。然而，在已经处理过的区域和新处理的区域之间的搭界带上会产生回火的效果，这样会使得该区域的硬度会稍微低于硬化处理的其他区域。我们进行了大量的试验通过控制能量密度以及其他参数，最终我们能够确认在相邻两条热处理带之间距离在<chmetcnv wst="on" unitname="mm" sourcevalue="15" hasspace="False" negative="False" numbertype="1" tcsc="0"><span lang="EN-US">15mm</span></chmetcnv>左右能够使得搭界区域的回火效果减到最小，硬度在<span lang="EN-US">55-65Rc</span>，处理深度在<span lang="EN-US">0.7<chmetcnv wst="on" unitname="mm" sourcevalue="1.5" hasspace="False" negative="True" numbertype="1" tcsc="0">-1.5mm</chmetcnv></span>，而我们开始假定的能达到的深度是<chmetcnv wst="on" unitname="mm" sourcevalue=".5" hasspace="False" negative="False" numbertype="1" tcsc="0"><span lang="EN-US">0.5mm</span></chmetcnv>。<span lang="EN-US"><p></p></span></span></p><p></p></span><p></p><p><span lang="EN-US" style="FONT-SIZE: 10pt; FONT-FAMILY: Arial; mso-fareast-font-family: 宋体; mso-font-kerning: 1.0pt; mso-ansi-language: EN-US; mso-fareast-language: ZH-CN; mso-bidi-language: AR-SA;"><em>Figure 6: This sample was produced by shifting the beam <chmetcnv wst="on" unitname="mm" sourcevalue="15" hasspace="True" negative="False" numbertype="1" tcsc="0">15 mm</chmetcnv> from the initial pass <br/>to produce the second pass. The region marked A is untempered martensite. B marks <br/>the region in which the martensite is tempered. C indicates the base metal <br/>(2% Nital etch, 50X magnification).</em></span></p><p><span lang="EN-US" style="FONT-SIZE: 10pt; FONT-FAMILY: Arial; mso-fareast-font-family: 宋体; mso-font-kerning: 1.0pt; mso-ansi-language: EN-US; mso-fareast-language: ZH-CN; mso-bidi-language: AR-SA;"></span><br/></p><br/><span lang="EN-US" style="FONT-SIZE: 10pt; FONT-FAMILY: Arial; mso-fareast-font-family: 宋体; mso-ansi-language: EN-US; mso-fareast-language: ZH-CN; mso-bidi-language: AR-SA;"><em>Figure 7: The relationship between back-temper and case depth at a <chmetcnv wst="on" unitname="mm" sourcevalue="15" hasspace="False" negative="False" numbertype="1" tcsc="0">15mm</chmetcnv> displacement. <br/>Surface Transformation Hardening of Gray Cast Iron</em></span>4000W半导体激光器
<p><br/><font color="#ffffff"></font></p>1000W半导体激光器,摩托车头盔大小
<br/>1000W光纤耦合半导体激光器
<p><br/>1000W光纤耦合半导体激光器</p><p></p><p><br/>焊接头</p><p></p><p></p><p>熔覆头<br/></p>
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