半导体晶圆制造设备货品清单
<p>项次<br/>设备类别<br/>ECCN<br/>对应之货品号列(C.C.C)<br/>货品名称</p><p>1<br/>供半导体晶圆铜导线用之化学机械研磨机 Chemical machanical polisher(CMP)<br/>(WA未列管)<br/>8464.20.10.00-7<br/>供半导体晶圆制程用之磨光、拋光及研磨机器Grinding, polishing and lapping machines for processing of semiconductor wafers</p><p>2<br/>供半导体晶圆制造用之光阻剥除机Photo-resist stripper<br/>(WA未列管)<br/>8456.99.30.00-9<br/>去除光阻物或清洗半导体晶圆之器具Apparatus for stripping or cleaning semiconductor wafers</p><p>3<br/>供半导体晶圆制造用之光阻显影机Photo-resist developer<br/>3.B.1.f<br/>8479.89.83.00-0<br/>供湿蚀刻、显影、去除光阻物或清洗半导体晶圆及平板显示器之器具Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays</p><p>4<br/>供半导体晶圆制造用之快速高温热处理机Rapid thermal processor(RTP)<br/>3.B.1.a<br/>8514.30.10.00-5<br/>半导体晶圆快速加热器具Apparatus for rapid heating of semiconductor wafers</p><p>5<br/>供半导体晶圆制造用之沉积设备Deposition apparatus<br/>1.B.1.d, 2.B.5.a, 3.B.1.a, 3.B.1.d, 3.B.1.e<br/>8419.89.60.00-0<br/>生产半导体用化学蒸着沉积器具Chemical vapor deposition apparatus for semiconductor production</p><p>8479.89.82.00-1<br/>供溅镀半导体晶圆产生物理气相沉积之器具Apparatus for physical deposition by sputtering on semiconductor wafers</p><p>8479.89.86.00-7<br/>半导体晶圆叠晶沉积机Epitaxial deposition machines for semiconductor wafers</p><p>8479.89.88.00-5<br/>制造半导体用之物理气相沉积器具Physical deposition apparatus for semiconductor production</p><p>8479.89.91.00-0<br/>生产半导体用化学蒸着沉积器具，非属第8419.89目者Chemical vapor deposition apparatus for semiconductor production other than articles of subheading No. 8419. 89</p><p>6<br/>供半导体晶圆制造用之洗净设备Cleaning equipment<br/>(WA未列管)<br/>8424.89.22.00-0<br/>供蚀刻、去除光阻物或清洗半导体晶圆之喷洒机具Spraying appliances for etching, stripping or cleaning semiconductor wafers</p><p>7<br/>供半导体晶圆制造用之干燥机 Dryer<br/>(WA未列管)<br/>8421.19.10.00-2<br/>半导体晶圆加工用旋转干燥机Spin dryers for semiconductor wafer processing</p><p>8479.89.89.00-4<br/>供感光乳剂涂附在半导体晶圆上之旋转器Spinners for coating photographic emulsions on semiconductor wafers</p><p>8<br/>供半导体晶圆制造用之电子显微镜Electron microscopes<br/>3.B.1.f<br/>9011.20.10.00-3<br/>附有专供半导体晶圆或网线上下料及传送设备用之显微照相显微镜Photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles</p><p>9012.10.10.00-4<br/>附有专供半导体晶圆或网线上下料及传送设备用之电子束显微镜Electron beam microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or retices</p><p>9<br/>供半导体晶圆制造用之蚀刻机Etcher<br/>3.B.1.c, 3.B.1.e<br/>8456.91.00.00-3<br/>供半导体材料干式蚀刻图形用工具机Machine-tools for dry-etching patterns on semiconductor materials</p><p>8543.30.10.00-0<br/>供湿蚀刻、显影、去除光阻物或清洗半导体晶圆及平板显示器之器具Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays</p><p>10<br/>供半导体晶圆制造用之离子植入机Ion implanter<br/>3.B.1.b<br/>8543.11.00.00-5<br/>供掺杂半导体材料之离子植入器 Ion implanters for doping semiconductor materials</p><p>11<br/>供半导体晶圆制造用之光阻涂布机Photo-resist coater <br/>3.B.1.f<br/>8479.89.99.30-6<br/>制造半导体晶圆用之光阻涂布器具 Photo-resist coaters for semiconductor wafers </p><p>12<br/>供半导体晶圆制造用之微影设备 lithography equipment<br/>3.B.1.f<br/>9010.42.00.10-8<br/>生产半导体晶圆用之步进对准机 Steppers for semiconductor wafers </p><p>9010.42.00.20-6<br/>生产半导体晶圆用之扫描对准机Scanners for semiconductor wafers </p><p>8456.99.20.10-9<br/>半导体制程中，供制造光罩及网线之电子束直写机E-beam writers to produce masks and reticles for patterns on semiconductor devices </p> 比较齐全就是有一点不太还,我还没全部用到过呵呵! 象天书一样,毕竟是隔行如隔山啊
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